Hollow glass microspheres that cut density by up to 60%, insulate at 600 °C, survive 30,000 psi — and land at 30–50% below legacy Western grades. From a single-site 30,000 t/yr plant with lot-level certification.
Cenospheres are a lottery. Polymer microspheres melt at paint-bake temperature. Solid mineral fillers sink the density. Engineered hollow glass is the only filler that delivers lightweight, strength, insulation and dielectric control in one specification.
| Property | Our HGM | Cenospheres | Polymer spheres | Solid fillers |
|---|---|---|---|---|
| True density | 0.10–0.70 g/cc (tunable) | 0.4–0.8 g/cc (unstable) | 0.03–0.13 g/cc | 2.4–2.6 g/cc |
| Crush strength | Up to 30,000 psi | Low, batch variance high | Poor above 120 °C | High but heavy |
| Thermal stability | 600 °C+ softening | Variable composition | 80–150 °C limit | High but no insulation |
| Batch consistency | ±0.02 g/cc, CV < 5% | Wide scatter | Good | Good |
| Resin demand | Low oil absorption → less resin | Surface defects absorb resin | Good | High loading weight penalty |
| Cost per volume | Low for engineered grade | Low but hidden QC cost | 3–8× higher | Cheapest per kg, costly per part |
| Functions combined | Lightweight + insulation + low Dk + flow | Lightweight only | Lightweight only | Reinforcement only |
Free 1 kg samples with COA, a formulation worksheet for your matrix, and a 24-hour technical response. Tell us your resin system — we match the grade.